Honda Teams Up With Renesas To Develop SoC For SDVs

A high-performance system-on-chip (SoC) for software-defined vehicles (SDVs) has been developed by auto giant Honda Motor Co. and Renesas Electronics Corporation. This technology is expected to provide cutting-edge AI performance and be used in future models of Honda's new electric vehicle (EV) series such as those of the 0 Series, which was unveiled as a prototype at CES 2025.

The Honda 0 Series will use a centralised E/E architecture, which combines several electronic control units (oecus) in charge of managing various vehicle functions into one ECU. The core ECU, which is the central component of the SDV, controls key vehicle functions like powertrain control, comfort features, Advanced Driver Assistance Systems (ADAS) and Automated Driving (AD), while minimising increases in energy consumption, says Honda.
In order to realise a system that uses multi-die chiplet technology, Honda and Renesas have reached an agreement to develop a high-performance system-on-chip solution for cor oecus. This will involve using Renesas' fifth-generation system-on-chip with an AI accelerator optimised for AI software, which Honda developed independently.
Honda and Renesas have been working closely together for many years, and the automaker believes that this arrangement would speed up the incorporation of cutting-edge software and semiconductor technologies into the next generation of software-defined vehicles, the Honda 0 Series.